Physical vapour deposition (PVD) is used to describe any of a variety of methods to deposit thin films by the condensation of a vaporized form of material onto various surfaces. The metallic elements of the layers consist of titanium, chrome and aluminium, make a connection to nitrogen and carbon, under impact of a plasma and temperatures of 200 °C to 500 °C. They provide a strong ceramic in this way. The hardness of generated layers are in a range of 1000 to 3800 HV, the coating thickness is between 1 to 10 µm, depending of use.
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